EN 61188-1-2:1998

INTRODUCTION
1 Scope
2 Normative references
3 Engineering design overview
    3.1 Device selection
    3.2 Intraconnection
    3.3 Printed board and printed board assemblies
    3.4 Performance requirements
    3.5 Power distribution
4 Design of controlled impedance circuits
    4.1 Configurations
    4.2 Equations
    4.3 Controlled impedance design rules
    4.4 Cross-talk rules
    4.5 Coupon design rules
    4.6 Decoupling/capacitor rules
5 Design for manufacturing
    5.1 Process rules in CAD
    5.2 Design complexity and correlation to cost
6 Data description
    6.1 Details of construction
    6.2 Isolation of data by net class (noise, timing,
          capacitance and impedance)
    6.3 Electrical performance
7 Material
    7.1 Resin systems
    7.2 Reinforcements
    7.3 Prepregs, bonding layers and adhesives
    7.4 Frequency dependence
8 Fabrication
    8.1 General
    8.2 Preproduction processes
    8.3 Production processes
    8.4 Impact of defects at high frequencies
    8.5 Data description
9 Time domain reflectometry (TDR) testing
    9.1 Rationale
Annex A Units, symbols and terminology
Annex ZA Normative references to international publications
          with their corresponding European publications

The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.