• NF EN 61188-1-2 : 2000

    Current The latest, up-to-date edition.

    PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 1-2: GENERIC REQUIREMENTS - CONTROLLED IMPEDANCE

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    Published date:  12-01-2013

    Publisher:  Association Francaise de Normalisation

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 Engineering design overview
        3.1 Device selection
        3.2 Intraconnection
        3.3 Printed board and printed board assemblies
        3.4 Performance requirements
        3.5 Power distribution
    4 Design of controlled impedance circuits
        4.1 Configurations
        4.2 Equations
        4.3 Controlled impedance design rules
        4.4 Cross-talk rules
        4.5 Coupon design rules
        4.6 Decoupling/capacitor rules
    5 Design for manufacturing
        5.1 Process rules in CAD
        5.2 Design complexity and correlation to cost
    6 Data description
        6.1 Details of construction
        6.2 Isolation of data by net class (noise, timing,
              capacitance and impedance)
        6.3 Electrical performance
    7 Material
        7.1 Resin systems
        7.2 Reinforcements
        7.3 Prepregs, bonding layers and adhesives
        7.4 Frequency dependence
    8 Fabrication
        8.1 General
        8.2 Preproduction processes
        8.3 Production processes
        8.4 Impact of defects at high frequencies
        8.5 Data description
    9 Time domain reflectometry (TDR) testing
        9.1 Rationale
    Annex A Units, symbols and terminology
    Annex ZA Normative references to international publications
              with their corresponding European publications

    Abstract - (Show below) - (Hide below)

    Intended for use by circuit designers, packaging engineers, printed board manufacturers and procurement personnel in order that all may have a common understanding of each area. Intended to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are specified as designs where the interconnecting properties affect circuit performance and need unique considerations.

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    Development Note INDICE DE CLASSEMENT : C93-623
    Document Type Standard
    Publisher Association Francaise de Normalisation
    Status Current
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