IEC 61188-1-2:1998

1. Scope
2. Normative references
3. Engineering design overview
    3.1 Device selection
    3.2 Interconnection
    3.3 Printed board and printed board assemblies
    3.4 Performance requirements
    3.5 Power distribution
4. Design of controlled impedance circuits
    4.1 Configurations
    4.2 Equations
    4.3 Controlled impedance design rules
    4.4 Cross-talk rules
    4.5 Coupon design rules
    4.6 Decoupling/capacitor rules
5. Design for manufacturing
    5.1 Process rules in CAD
    5.2 Design complexity and correlation to cost
6. Data description
    6.1 Details of construction
    6.2 Isolation of data by net class (noise, timing,
         capacitance and impedance)
    6.3 Electrical performance
7. Material
    7.1 Resin systems
    7.2 Reinforcements
    7.3 Prepregs, bonding layers and adhesives
    7.4 Frequency dependence
8. Fabrication
    8.1 General
    8.2 Preproduction processes
    8.3 Production processes
    8.4 Impact of defects at high frequencies
    8.5 Data description
9. Time domain reflectrometry (TDR) testing
    9.1 Rationale
Annex A - Units, symbols, and terminology

The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.