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EN 61249-2-12:1999

Current

Current

The latest, up-to-date edition.

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

Published date

14-04-1999

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FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
7 Non-electrical properties of the base material after
  complete removal of the copper foil
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
        reference numbers
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Gives requirements for properties of epoxide non-woven aramid copper clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.

Committee
CLC/SR 91
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

EN 62326-1:2002 Printed boards - Part 1: Generic specification
BS EN 62326-1:2002 Printed boards Generic specification
CEI EN 62326-1 : 2002 PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
I.S. EN 62326-1:2002 PRINTED BOARDS - GENERIC SPECIFICATION

EN 61249-5-1:1996 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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