• BS EN 61249-2-12 : 1999

    Current The latest, up-to-date edition.

    MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - EPOXIDE NON-WOVEN ARAMID LAMINATE OF DEFINED FLAMMABILITY, COPPER-CLAD

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-1999

    Publisher:  British Standards Institution

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    Committee EPL/501
    Development Note Also numbered as IEC 61249-2-12 Supersedes 95/208512 DC (08/2004)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS 6221-21(2001) : 2001 PRINTED WIRING BOARDS - GUIDE TO THE REWORK OF UNASSEMBLED BOARDS

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 61249-5-1 : 1996 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH AND WITHOUT COATINGS - SECTION 1: COPPER FOILS (FOR THE MANUFACTURE OF COPPER-CLAD BASE MATERIALS)
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    EN 61189-2 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES
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