Committee
|
EPL/501 |
Development Note
|
Also numbered as IEC 61249-2-12 Supersedes 95/208512 DC (08/2004) |
Document Type
|
Standard |
ISBN
|
|
Pages
|
|
Published
|
|
Publisher
|
British Standards Institution
|
Status
|
Current |
Supersedes
|
|
BS 6221-21:2001
|
Printed wiring boards Guide to the rework of unassembled boards |
EN 61249-5-1:1996
|
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
IEC 61189-1:1997+AMD1:2001 CSV
|
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
IEC 61249-5-1:1995
|
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
IEC 61189-3:2007
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
IEC 61189-2:2006
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
EN 61189-2:2006
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
Unfortunately, this product is not available for purchase in your region.
-
Access your standards online with a subscription
Features
- Simple online access to standards, technical information and regulations
- Critical updates of standards and customisable alerts and notifications
- Multi - user online standards collection: secure, flexibile and cost effective