EN 61249-3-5:1999
Current
The latest, up-to-date edition.
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
15-04-1999
FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Designation
6 Properties of adhesive films
7 Dimensions and tolerances
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
reference numbers
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.
| Committee |
CLC/SR 91
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61249-3-5:1999 | Identical |
| NF EN 61249-3-5 : 2002 | Identical |
| NBN EN 61249 3-5 : 2000 | Identical |
| NEN EN IEC 61249-3-5 : 1999 | Identical |
| I.S. EN 61249-3-5:1999 | Identical |
| UNE-EN 61249-3-5:2000 | Identical |
| PN EN 61249-3-5 : 2002 | Identical |
| SN EN 61249-3-5 : 1999 | Identical |
| BS EN 61249-3-5:1999 | Identical |
| DIN EN 61249-3-5:1999-11 | Identical |
| EN 60249-2-15 : 1994 AMD 1 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY |
| EN 60249-2-8 : 1994 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM |
| IEC 60249-2-8:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
| EN 60249-2-13 : 1994 AMD 1 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 13: FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE |
| IEC 60249-2-15:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability |
| IEC 60249-2-13:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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