• EN 62137-1-2:2007

    Current The latest, up-to-date edition.

    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

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    Published date:  31-08-2007

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General remarks
    5 Test equipment and materials
       5.1 Shear test equipment
       5.2 Pushing tool
       5.3 Optical microscope
       5.4 Scanning electron microscope (SEM)
       5.5 Reflow soldering oven
       5.6 Test substrate
       5.7 Solder alloy
       5.8 Solder paste
    6 Mounting method
    7 Test conditions
       7.1 Test: Rapid change of temperature
       7.2 Shear strength test
    8 Test procedure
       8.1 Test sequence
       8.2 Pre-conditioning
       8.3 Initial shear strength
       8.4 Rapid change of temperature
       8.5 Recovery
       8.6 Intermediate/final shear strength
    9 Items to be included in the test report
    10 Items to be given in the product specification
    Annex A (normative) - Shear strength test - Details
    Bibliography
    Annex ZA (normative) - Normative references to international
                           publications with their corresponding
                           European publications

    Abstract - (Show below) - (Hide below)

    The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

    General Product Information - (Show below) - (Hide below)

    Committee CLC/SR 91
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 62137-3:2012 Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
    CEI EN 62137-3 : 2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
    I.S. EN 62137-3:2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV))
    EN 62137-3:2012 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    EN 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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