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BS EN 62137-1-2:2007

Current

Current

The latest, up-to-date edition.

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-10-2007

1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
   5.1 Shear test equipment
   5.2 Pushing tool
   5.3 Optical microscope
   5.4 Scanning electron microscope (SEM)
   5.5 Reflow soldering oven
   5.6 Test substrate
   5.7 Solder alloy
   5.8 Solder paste
6 Mounting method
7 Test conditions
   7.1 Test: Rapid change of temperature
   7.2 Shear strength test
8 Test procedure
   8.1 Test sequence
   8.2 Pre-conditioning
   8.3 Initial shear strength
   8.4 Rapid change of temperature
   8.5 Recovery
   8.6 Intermediate/final shear strength
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) - Shear strength test - Details
Bibliography
Annex ZA (normative) - Normative references to international
                       publications with their corresponding
                       European publications

Applies to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads.

The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

Committee
EPL/501
DevelopmentNote
Supersedes 05/30133599 DC. (10/2007)
DocumentType
Standard
Pages
20
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
EN 61340-3-1:2002 Identical
NBN EN 62137-1-2 : 2007 Identical
EN 62137-1-2:2007 Identical
NF EN 62137-1-2 : 2014 Identical
IEC 62137-1-2:2007 Identical
DIN EN 62137-1-2:2008-02 Identical
I.S. EN 62137-1-2:2007 Identical

IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
EN 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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