• IEC 62137-1-2:2007

    Current The latest, up-to-date edition.

    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French

    Published date:  25-07-2007

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General remarks
    5 Test equipment and materials
       5.1 Shear test equipment
       5.2 Pushing tool
       5.3 Optical microscope
       5.4 Scanning electron microscope (SEM)
       5.5 Reflow soldering oven
       5.6 Test substrate
       5.7 Solder alloy
       5.8 Solder paste
    6 Mounting method
    7 Test conditions
       7.1 Test: Rapid change of temperature
       7.2 Shear strength test
    8 Test procedure
       8.1 Test sequence
       8.2 Pre-conditioning
       8.3 Initial shear strength
       8.4 Rapid change of temperature
       8.5 Recovery
       8.6 Intermediate/final shear strength
    9 Items to be included in the test report
    10 Items to be given in the product specification
    Annex A (normative) Shear strength test - Details
    Bibliography

    Abstract - (Show below) - (Hide below)

    The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note A Bilingual edition has been published. (05/2008) Stability Date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 62137-3:2012 (published 2012-03) Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
    DD IEC PAS 62137-3 : DRAFT 2008 ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
    09/30206176 DC : DRAFT JUNE 2009 BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
    BS EN 62321-2:2014 (published 2014-05) Determination of certain substances in electrotechnical products Disassembly, disjointment and mechanical sample preparation
    CEI EN 62137-3 : 2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
    BS EN 62878-1-1 : 2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    I.S. EN 62137-3:2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV))
    I.S. EN 62321-2:2014 DETERMINATION OF CERTAIN SUBSTANCES IN ELECTROTECHNICAL PRODUCTS - PART 2: DISASSEMBLY, DISJOINTMENT AND MECHANICAL SAMPLE PREPARATION
    IEC PAS 62137-3:2008 Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
    I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    EN 62321-2 : 2014 DETERMINATION OF CERTAIN SUBSTANCES IN ELECTROTECHNICAL PRODUCTS - PART 2: DISASSEMBLY, DISJOINTMENT AND MECHANICAL SAMPLE PREPARATION (IEC 62321-2:2013)
    IEC 62137-3:2011 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
    EN 62878-1-1 : 2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS (IEC 62878-1-1:2015)
    EN 62137-3 : 2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011)

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    IEC 61249-2-7:2002 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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