IEC 62137-1-2:2007

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
   5.1 Shear test equipment
   5.2 Pushing tool
   5.3 Optical microscope
   5.4 Scanning electron microscope (SEM)
   5.5 Reflow soldering oven
   5.6 Test substrate
   5.7 Solder alloy
   5.8 Solder paste
6 Mounting method
7 Test conditions
   7.1 Test: Rapid change of temperature
   7.2 Shear strength test
8 Test procedure
   8.1 Test sequence
   8.2 Pre-conditioning
   8.3 Initial shear strength
   8.4 Rapid change of temperature
   8.5 Recovery
   8.6 Intermediate/final shear strength
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) Shear strength test - Details
Bibliography

The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.