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CEN
EN ISO 9455-2:1995

EN ISO 9455-2:1995

Current

Current

The latest, up-to-date edition.

Soft soldering fluxes - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method (ISO 9455-2:1993)

Published date

20-09-1995

Publisher

Comite Europeen de Normalisation

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Foreword
1 Scope
2 Normative references
3 Principle
4 Apparatus
5 Procedure
6 Calculation of results
7 Precision
8 Test report
Annex A (informative) Method for the preparation of standard
                       reference rosin (colophony) based
                       liquid fluxes, having 25% (m/m)
                       non-volatile content
Annex ZA (normative) Normative references to international
                       publications with their relevant European
                       publications

The method specified is based on evaporating a weighed amount of the flux sample in an ebulliometer until the entire volatile part is driven off, which is determined by following the graph of distillation temperature against time. The flux residue is considered as the non-volatile content of flux. Applies only to flux with a non-volatile content of 10 % or more.

Committee
CEN/TC 121
DocumentType
Standard
PublisherName
Comite Europeen de Normalisation
Status
Current

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I.S. EN 61189-5:2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
EN ISO 9454-2:2000 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
DIN EN ISO 9455-6:1997-03 Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:1995); German version EN ISO 9455-6:1997
I.S. EN 61189-5-2:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES

IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
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