I.S. EN 61189-5:2006
Current
The latest, up-to-date edition.
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
Hardcopy , PDF
English
01-01-2006
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
3.1 Accuracy
3.2 Precision
3.3 Resolution
3.4 Report
3.5 Student's t distribution
3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
5.1 Test 5P01: Test-board design guideline
5.2 Test 5P02: Standard mounting process for CSP/BGA packages
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
8.1 Test 5C01: Corrosion, flux
9 M: Mechanical test methods
9.1 Test 5M01: Peel test method for test-board land
10 E: Electrical test methods
10.1 Test 5E01: Changes of the surface insulation resistance
caused by fluxes
10.2 Test 5E02: Surface insulation resistance, assemblies
11 N Environmental test methods
11.1 Test 5N01: Reflow solderability test for soldering joint
11.2 Test 5N02: Resistance to reflow solderability of test board
11.3 Test 5N03: Solderability test for test-board land
12 X Miscellaneous test methods
12.1 Test 5X01: Liquid flux activity, wetting balance method
12.2 Test 5X02: Paste flux viscosity - T-Bar spindle method
12.3 Test 5X03: Spread test, liquid or extracted solder
flux, solder paste and extracted cored wires or preforms
12.4 Test 5X04: Solder paste viscosity - T-Bar spin
spindle method (applicable to 300 Pa.s to 1,600 Pa.s)
12.5 Test 5X05: Solder paste viscosity - T-Bar spindle
method (applicable to Pa.s)
12.6 Test 5X06: Solder paste viscosity - Spiral pump
method (applicable to 300 Pa.s to 1,600 Pa.s)
12.7 Test 5X07: Solder paste viscosity - Spiral pump
method (applicable to Pa.s)
12.8 Test 5X08: Solder paste - Slump test
12.9 Test 5X09: Solder paste - Solder ball test
12.10 Test 5X10: Solder paste - Tack test
12.11 Test 5X11: Solder paste - Wetting test
12.12 Test 5X12: Flux residues - Tackiness after drying
12.13 Test 5X13: Spitting of flux-cored wire solder
12.14 Test 5X14: Solder pool test
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Presents a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
74
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 61189-5:2006 | Identical |
| IEC 61189-5:2006 | Identical |
| BS EN 61189-5:2006 | Equivalent |
| UNE-EN 61189-5:2006 | Equivalent |
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