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    I.S. EN 61189-5:2006

    Current The latest, up-to-date edition.

    TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2006

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Accuracy, precision and resolution
       3.1 Accuracy
       3.2 Precision
       3.3 Resolution
       3.4 Report
       3.5 Student's t distribution
       3.6 Suggested uncertainty limits
    4 Catalogue of approved test methods
    5 P: Preparation/conditioning test methods
       5.1 Test 5P01: Test-board design guideline
       5.2 Test 5P02: Standard mounting process for CSP/BGA packages
    6 V: Visual test methods
    7 D: Dimensional test methods
    8 C: Chemical test methods
       8.1 Test 5C01: Corrosion, flux
    9 M: Mechanical test methods
       9.1 Test 5M01: Peel test method for test-board land
    10 E: Electrical test methods
       10.1 Test 5E01: Changes of the surface insulation resistance
            caused by fluxes
       10.2 Test 5E02: Surface insulation resistance, assemblies
    11 N Environmental test methods
       11.1 Test 5N01: Reflow solderability test for soldering joint
       11.2 Test 5N02: Resistance to reflow solderability of test board
       11.3 Test 5N03: Solderability test for test-board land
    12 X Miscellaneous test methods
       12.1 Test 5X01: Liquid flux activity, wetting balance method
       12.2 Test 5X02: Paste flux viscosity - T-Bar spindle method
       12.3 Test 5X03: Spread test, liquid or extracted solder
             flux, solder paste and extracted cored wires or preforms
       12.4 Test 5X04: Solder paste viscosity - T-Bar spin
             spindle method (applicable to 300 Pa.s to 1,600 Pa.s)
       12.5 Test 5X05: Solder paste viscosity - T-Bar spindle
             method (applicable to Pa.s)
       12.6 Test 5X06: Solder paste viscosity - Spiral pump
             method (applicable to 300 Pa.s to 1,600 Pa.s)
       12.7 Test 5X07: Solder paste viscosity - Spiral pump
             method (applicable to Pa.s)
       12.8 Test 5X08: Solder paste - Slump test
       12.9 Test 5X09: Solder paste - Solder ball test
       12.10 Test 5X10: Solder paste - Tack test
       12.11 Test 5X11: Solder paste - Wetting test
       12.12 Test 5X12: Flux residues - Tackiness after drying
       12.13 Test 5X13: Spitting of flux-cored wire solder
       12.14 Test 5X14: Solder pool test
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications
    Bibliography

    Abstract - (Show below) - (Hide below)

    Presents a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    EN 62137:2004/corrigendum:2005 ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    ISO 9455-2:1993 Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
    IEC 62137:2004 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
    EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    ISO 9455-1:1990 Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
    EN ISO 9001:2015 Quality management systems - Requirements (ISO 9001:2015)
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    EN 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
    ISO 5725-2:1994 Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method
    ISO 9001:2015 Quality management systems — Requirements
    IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
    EN 61189-1 : 97 AMD 1 2001 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    EN 29455-1:1993 Soft soldering fluxes - Test methods - Part 1: Determination of non-volatile matter, gravimetric method (ISO 9455-1:1990)
    EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    IPC TR 467 : 0 SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES)
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    EN ISO 9455-2:1995 Soft soldering fluxes - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method (ISO 9455-2:1993)
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