GR 1217 CORE : ISSUE 2

Preface
1 Introduction
      1.1 Scope
      1.2 Application
      1.3 Document Organization
      1.4 Major Changes from TR-NWT-001217, Issue 1
      1.5 Requirements Terminology
      1.6 Requirement Labeling Conventions
              1.6.1 Numbering of Requirement and Related Objects
              1.6.2 Requirement, Conditional Requirement, and
                        Objective Object Identification
2 General Requirements and Administration
      2.1 Safety
      2.2 Other Requirements
      2.3 Nonconformance
      2.4 Administration
      2.5 Numerical Values
      2.6 Workmanship Standards
3 System Requirements for Connector Products
      3.1 Environmental Exposure Requirements
              3.1.1 IEEE Std 1156.1-1993 (IEEE Standard
                        Microcomputer Environmental Specifications
                        for Computer Modules)
              3.1.2 IEEE Std 1156.1-1993 Performance Levels
                        3.1.2.1 Maximum Exposure Temperature
                        3.1.2.2 Other Environmental Requirements
      3.2 System Quality Requirements
              3.2.1 Basis for Quality Classification
              3.2.2 SQ Requirement I for Small Systems
              3.2.3 SQ Requirement II for Medium Systems
              3.2.4 SQ Requirement III for Large Systems
4 Connector Classification and Reliability Assurance
      4.1 Classification by Quality Level
      4.2 Methodology to Demonstrate Reliability
              4.2.1 Connector Failure Rates Determined from
                        Field Experience
              4.2.2 Failure Mechanisms Considered in Connector
                        Qualification
      4.3 Organization of Qualification Procedures and
              Reliability Verification
              4.3.1 Standard Testing Procedures
              4.3.2 New Technology Prequalification and
                        Reliability Verification
      4.4 The Concept of Performance Testing
      4.5 Connector Qualification
      4.6 Incoming Inspection Acceptance Tests
              4.6.1 Ship-to-Stock Practices
5 Design Requirements
      5.1 Physical and Mechanical Requirements
              5.1.1 General
              5.1.2 Contact Normal Force
              5.1.3 Contact Wipe
              5.1.4 Geometry of Contact Surfaces
              5.1.5 Mate/Unmate Force
              5.1.6 Insertion/Removal Force
              5.1.7 Plated Through-Hole Requirements
                        for Use with Press Fit Pins
              5.1.8 Contact Strength
              5.1.9 Polarizing Method
      5.2 Contact Metallization
              5.2.1 General
              5.2.2 Contact Metallization Thickness
              5.2.3 Porosity
              5.2.4 Contact Finish, Surface Roughness, and
                        Adhesion
              5.2.5 Durability of Contact Finishes
      5.3 Lubrication
              5.3.1 Lubrication of Noble Metallizations
              5.3.2 Lubrication of Non-Noble Metallizations
      5.4 Electrical Requirements
              5.4.1 Contact Resistance
              5.4.2 Contact Resistance Stability
              5.4.3 Contact Disturbance
              5.4.4 Low-Nanosecond Events
              5.4.5 Current Rating
              5.4.6 Temperature Rise at Rating
              5.4.7 Insulation Resistance
              5.4.8 Withstanding Voltage
      5.5 Temperature/Humidity Stress Immunity
      5.6 Miscellaneous Requirements for Special Connector Types
              5.6.1 Semi-Permanent Mechanical Connections
              5.6.2 Component Sockets
              5.6.3 Component Socket Usage
              5.6.4 Zero Insertion Force Connectors
              5.6.5 Coaxial Connectors
      5.7 Summary Table for Design Requirements for
              Separable Connectors
6 Design Verification and Performance Testing
      6.1 Physical and Mechanical Requirements
              6.1.1 Visual Examination
              6.1.2 Examination of Dimension, Markings, and Mass
              6.1.3 Contact Normal Force
              6.1.4 Mate/Unmate Force
              6.1.5 Insertion/Removal Force
              6.1.6 Plated-through Hole Requirements for
                        Use with Press Fit Pins
              6.1.7 Contact Strength
              6.1.8 Contact Metallization Thickness
              6.1.9 Contact Finish, Surface Roughness, Porosity,
                        and Adhesion
              6.1.10 Durability of Noble Metal Contact Finishes
              6.1.11 Durability of Non-noble Metal Contact Finishes
      6.2 Electrical Requirements
              6.2.1 Low-Level Contact Resistance (LLCR)
              6.2.2 Contact Resistance (Special Test Current
                        Method)
              6.2.3 Contact Disturbance
              6.2.4 Low-Nanosecond Events
              6.2.5 Current Rating
              6.2.6 Temperature Rise at Rating
              6.2.7 Insulation Resistance
              6.2.8 Withstanding Voltage
      6.3 Environmental Stress Immunity
              6.3.1 General
              6.3.2 Temperature Life
              6.3.3 Thermal Shock
              6.3.4 Moisture Resistance (Humidity with Thermal
                        Cycling) Test
              6.3.5 Vibration and Mechanical Shock Testing
                        6.3.5.1 Testing "Connectors Without
                                    Mass Loading"
                        6.3.5.2 Testing "PWB/Connector Assemblies"
                        6.3.5.3 Testing "System Level Assemblies,"
                                    Vibration Only
              6.3.6 Four-Gas MFG Testing
      6.4 Special Tests for Semi-Permanent Mechanical Connections
              6.4.1 Contact Resistance Stability of
                        Semi-Permanent Connections
              6.4.2 Gas Tight Hermiticity of Non-noble Metal Contacts
              6.4.3 Flex/Pull Test for Semi-Permanent Cable
                        Connections
      6.5 Test Organization and Sequencing
              6.5.1 Samples Required
              6.5.2 Alternative Industry Standard Tests
              6.5.3 Qualification Test Environment
              6.5.4 EIA Qualification Test Sequences
7 New Technology Prequalification and Reliability
              Verification
      7.1 Purpose of Prequalification
              7.1.1 Prequalification in TR-NWT-001217 Versus
                        Prequalification in GR-1217-CORE
              7.1.2 Instances Where Prequalification Is Required
                        7.1.2.1 Specific Concerns
      7.2 Sample Sizes and Acceptance Criteria
              7.2.1 Sample Sizes and Criteria for Prequalification
                        7.2.1.1 Lot-to-Lot Sampling
                        7.2.1.2 Control Samples
      7.3 The Four Key Environmental Tests
              7.3.1 Temperature Life Test
              7.3.2 Humidity with Temperature Cycling Test
              7.3.3 Vibration and Mechanical Shock Testing
                        7.3.3.1 Testing "Connectors Without
                                    Mass Loading"
                        7.3.3.2 Testing "PWB/Connector Assemblies"
                        7.3.3.3 Testing "System Level Assemblies"
              7.3.4 Mixed Flowing Gas Testing
8 Requalification
      8.1 Significant Changes Requiring Requalification
      8.2 Periodic Partial Requalification
              8.2.1 Quality Level II and III
      8.3 Periodic Full Requalification
9 Test Methods
      9.1 Environmental Tests
              9.1.1 Environmental Preconditioning
                        9.1.1.1 Dust and Fiber Contamination
                                    Test Module
                        9.1.1.2 Prewear and Postwear Module
              9.1.2 Vibration and Mechanical Shock
                        9.1.2.1 Testing of Connectors Without
                                    Mass Loading
                        9.1.2.2 Vibration and Shock Tests for
                                    PWB/Connector Assemblies
                        9.1.2.3 Vibration and Shock Tests for
                                    System Level Assemblies
              9.1.3 Four Gas MFG Testing
                        9.1.3.1 Test Control and Verification
                        9.1.3.2 MFG Test Sequence with Parallel
                                    Mated and Unmated Exposure
                        9.1.3.3 MFG Test Sequence with Sequential
                                    Mated and Unmated Exposure
      9.2 Fretting and Lubrication Tests
              9.2.1 Fretting Test - Standard Rider/Flat Method
              9.2.2 Connector Hardware Vibration Test for
                        Fretting and Lubrication
              9.2.3 Hardware Test for Noble Metal Contacts
      9.3 Metal Finishes
              9.3.1 Thickness of Noble Metal Contact Finishes
              9.3.2 Noble Metal Porosity Testing
                        9.3.2.1 Alkaline Polysulfide Test for
                                    Porosity
                        9.3.2.2 Electrographic Testing - Paper
                        9.3.2.3 Electrographic Tests - Gel
                        9.3.2.4 Corrosive Gas Tests - Nitric Acid
                                    Vapor
              9.3.3 Finish Adherence
      9.4 Flex/Pull Test for Permanent Cable Connections
References
Glossary