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  • IPC 4554 : 0

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS

    Available format(s):  Hardcopy

    Superseded date:  04-06-2022

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 QUALITY ASSURANCE PROVISIONS
    APPENDIX 1 - Chemical Process Definitions
    APPENDIX 2 - Typical Process Sequence
    APPENDIX 3 - Qualification of ISn Process by the Board Supplier
    APPENDIX 4 - XRF Measurement Techniques
    APPENDIX 5 - Auger/XPS and Coulometric Stripping Techniques
    APPENDIX 6 - Tin Whiskers
    APPENDIX 7 - Solder Spread Test Protocol
    APPENDIX 8 - Standard Development Efforts for IPC-4554,
                 Specification for Immersion Tin Plating for
                 Printed Circuit Boards

    Abstract - (Show below) - (Hide below)

    Specifies the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards.

    General Product Information - (Show below) - (Hide below)

    Committee 4-10
    Development Note Included in IPC C 105 & IPC C 1000. (07/2009) 2007 Edition is available in German Language, see IPC 4554 GERMAN. 2007 Edition Re-Issued in January 2012 & incorporates AMD 1 2012. (02/2012) Also available in Chinese Language, see IPC 4554 CHINESE. (04/2015)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    12/30262263 DC : 0 BS IEC 62483 - ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHES
    IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 1601 GERMAN : - PRINTED BOARD HANDLING AND STORAGE GUIDELINES
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

    Standards Referencing This Book - (Show below) - (Hide below)

    GR 1217 CORE : ISSUE 2 GENERIC REQUIREMENTS FOR SEPARABLE ELECTRICAL CONNECTORS USED IN TELECOMMUNICATIONS HARDWARE
    IPC 6018 : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARDS
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 1601 : 0 PRINTED BOARD HANDLING AND STORAGE GUIDELINES
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IPC 6013 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
    IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
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