IPC 4556 : 0

1 SCOPE
2 APPLICABLE DOCUMENTS AND TERMS AND DEFINITIONS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
APPENDIX 1 - Chemical Definitions and Process
             Sequence
APPENDIX 2 - Round Robin Test Summary
APPENDIX 3 - ENEPIG PWB Surface Finish XRF Round
             Robin Testing
APPENDIX 4 - Factors Affecting Measurement Accuracy
             of ENEPIG Coatings by XRF
APPENDIX 5 - ENEPIG PWB Surface Finish Wetting
             Balance Testing
APPENDIX 6 - Solder Spread Testing
APPENDIX 7 - ENEPIG PWB Surface Finish Shear Test
             Project
APPENDIX 8 - Gold Wire Bonding
APPENDIX 9 - XRF Thickness Measurements of thin
             Au and Pd (ENEPIG): Recommendations
             for Instrumentation (Detectors) and
             their Limitations
APPENDIX 10 - Gage Capability. Gage R&R Type 1 Study
APPENDIX 11 - Solderability Testing Helps Select
              Surface Finishes

Defines the requirements for the use of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a surface finish for printed boards.