• IPC 4556 : 0

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS

    Available format(s): 

    Superseded date:  23-07-2013

    Language(s): 

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS AND TERMS AND DEFINITIONS
    3 REQUIREMENTS
    4 QUALITY ASSURANCE PROVISIONS
    APPENDIX 1 - Chemical Definitions and Process
                 Sequence
    APPENDIX 2 - Round Robin Test Summary
    APPENDIX 3 - ENEPIG PWB Surface Finish XRF Round
                 Robin Testing
    APPENDIX 4 - Factors Affecting Measurement Accuracy
                 of ENEPIG Coatings by XRF
    APPENDIX 5 - ENEPIG PWB Surface Finish Wetting
                 Balance Testing
    APPENDIX 6 - Solder Spread Testing
    APPENDIX 7 - ENEPIG PWB Surface Finish Shear Test
                 Project
    APPENDIX 8 - Gold Wire Bonding
    APPENDIX 9 - XRF Thickness Measurements of thin
                 Au and Pd (ENEPIG): Recommendations
                 for Instrumentation (Detectors) and
                 their Limitations
    APPENDIX 10 - Gage Capability. Gage R&R Type 1 Study
    APPENDIX 11 - Solderability Testing Helps Select
                  Surface Finishes

    Abstract - (Show below) - (Hide below)

    Defines the requirements for the use of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a surface finish for printed boards.

    General Product Information - (Show below) - (Hide below)

    Development Note Also available in CD-ROM format. (02/2013)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC 6011 : 0 GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
    ASTM B 733 : 2015 : REDLINE Standard Specification for Autocatalytic (Electroless) Nickel-Phosphorus Coatings on Metal
    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    GR 1217 CORE : ISSUE 2 GENERIC REQUIREMENTS FOR SEPARABLE ELECTRICAL CONNECTORS USED IN TELECOMMUNICATIONS HARDWARE
    MIL-C-28859 Revision B:1990 CONNECTOR COMPONENT PART, ELECTRICAL BACK PLANE, PRINTED WIRING, GENERAL SPECIFICATION FOR
    ASTM B 845 : 1997 Standard Guide for Mixed Flowing Gas (MFG) Tests for Electrical Contacts
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    ISO 4527:2003 Metallic coatings Autocatalytic (electroless) nickel-phosphorus alloy coatings Specification and test methods
    IPC 1601 : 0 PRINTED BOARD HANDLING AND STORAGE GUIDELINES
    MIL-STD-1580 Revision B:2003 DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IPC 6013 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
    IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 5704 : 0 CLEANLINESS REQUIREMENTS FOR UNPOPULATED PRINTED BOARDS
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