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NSAI
I.S. EN 60749-14:2003

I.S. EN 60749-14:2003

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2003

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
1 Scope
2 Normative references
3 General
4 Test condition A - Tension
5 Test condition B - Bending stress
6 Test condition C - Lead fatigue
7 Test condition D - Lead torque
8 Test condition E - Stud torque

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
42
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
UNE-EN 60749-14:2004 Identical
IEC 60749-14:2003 Identical
BS EN 60749-14:2003 Identical
NBN EN 60749-14 : 2004 Identical
DIN EN 60749-14:2004-07 Identical
EN 60749-14:2003 Identical
NF EN 60749-14 : 2004 Identical

IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

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