I.S. EN 60749-14:2003
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
Hardcopy , PDF
English
01-01-2003
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 General
4 Test condition A - Tension
5 Test condition B - Bending stress
6 Test condition C - Lead fatigue
7 Test condition D - Lead torque
8 Test condition E - Stud torque
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-14:2003 | Identical |
| BS EN 60749-14:2003 | Identical |
| NBN EN 60749-14 : 2004 | Identical |
| DIN EN 60749-14:2004-07 | Identical |
| EN 60749-14:2003 | Identical |
| NF EN 60749-14 : 2004 | Identical |
| UNE-EN 60749-14:2004 | Identical |
| IEC 60749-8:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing |
| EN 60749-8:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing |
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