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I.S. EN 60749-15:2010

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES

Available format(s)

Hardcopy , PDF

Superseded date

30-10-2020

Language(s)

English

Published date

01-01-2010

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

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FOREWORD
1 Scope
2 General
3 Test apparatus
4 Materials
5 Procedure
6 Summary
Bibliography

Provides a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
13
PublisherName
National Standards Authority of Ireland
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
UNE-EN 60749-15:2011 Identical
NF EN 60749-15 : 2011 Identical
IEC 60749-15:2010 Identical
SN EN 60749-15 : 2003 Identical
BS EN 60749-15:2010 Identical
DIN EN 60749-15:2011-06 Identical
EN 60749-15:2010/AC:2011 Identical
NBN EN 60749-15 : 2011 Identical

IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

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