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  • BS EN 60749-15:2010

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices

    Available format(s):  Hardcopy, PDF

    Superseded date:  01-10-2020

    Language(s):  English

    Published date:  30-06-2011

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    1 Scope
    2 General
    3 Test apparatus
    4 Materials
    5 Procedure
    6 Summary
    Bibliography

    Abstract - (Show below) - (Hide below)

    Defines a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.

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    Committee EPL/47
    Development Note Supersedes 00/203279 DC (07/2003) Supersedes BS EN 60749. (09/2005) Supersedes 09/30203267 DC. (02/2011)
    Document Type Standard
    Publisher British Standards Institution
    Status Superseded
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
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