I.S. EN 60749-23:2004
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE
Hardcopy , PDF
English
01-01-2004
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
4.1 Circuitry
4.1.1 Device schematic
4.1.2 Power
4.2 Device mounting
4.3 Power supplies and signal sources
4.4 Environmental chamber
5 Procedure
5.1 Stress duration
5.2 Stress conditions
5.2.1 Ambient temperature
5.2.2 Operating voltage
5.2.3 Biasing configurations
6 Cool-down
7 Measurements
8 Failure criteria
9 Summary
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
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