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I.S. EN 60749-37:2008

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2008

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test apparatus and components
  4.1 Test apparatus
  4.2 Test components
  4.3 Test board
  4.4 Test board assembly
  4.5 Number of components and sample size
5 Test procedure
  5.1 Test equipment and parameters
  5.2 Pre-test characterization
  5.3 Drop testing
6 Failure criteria and failure analysis
7 Summary
Annex A (informative) Preferred board construction,
        material, design and layout
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
50
PublisherName
National Standards Authority of Ireland
Status
Current
SupersededBy

Standards Relationship
EN 60749-37:2008 Identical
IEC 60749-37:2008 Identical

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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