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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE
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Available format(s): Hardcopy, PDF
Language(s): English
Published date: 01-01-2011
Publisher: National Standards Authority of Ireland
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.Only cited Standards give presumption of conformance to New Approach Directives/Regulations.Dates of withdrawal of national standards are available from NSAI.
FOREWORD1 Scope2 Normative references3 Terms and definitions4 Test equipment5 Test procedure6 Test method7 SummaryAnnex A (normative) - Drop impact test method using test rodAnnex B (informative) - An example of strain gauge attachment procedureAnnex ZA (normative) - Normative references to international publications with their corresponding European publications
Provides a procedure to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
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