I.S. EN 61076-4:1998
Current
The latest, up-to-date edition.
CONNECTORS WITH ASSESSED QUALITY, FOR USE IN D.C., LOW FREQUENCY ANALOGUE AND IN DIGITAL HIGH-SPEED DATA APPLICATIONS - PART 4: SECTIONAL SPECIFICATION - PRINTED BOARD CONNECTORS
Hardcopy , PDF
English
01-01-1998
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FOREWORD
1 General
1.1 Scope
1.2 Normative references
2 Technical information
2.1 Terminology
2.2 Classification into climatic categories
2.3 Creepage and clearance distances
2.4 Current-carrying capacity
2.5 IEC type designation
2.6 Marking
3 Quality assessment procedures
4 Tests and test schedules
4.1 General
4.2 Test procedures and measuring methods
4.3 Pre-conditioning
4.4 Wiring and mounting of specimens
4.4.1 Wiring
4.4.2 Mounting
4.5 Test schedules
4.5.1 Basic (minimum) test schedule
4.5.2 Full test schedules
4.5.2.1 Test group P - Primary
4.5.2.2 Test group AP - Dynamic/climatic
4.5.2.3 Test group BP - Mechanical endurance
4.5.2.4 Test group CP - Moisture
4.5.2.5 Test group DP - Electrical load
4.5.2.6 Test group FP - Mechanical resistivity
4.5.2.7 Test group FP - Chemical resistivity
4.5.2.8 Test group GP - Connections
4.5.2.9 Test group HP - Additional
4.5.3 Qualification approval test schedule
4.5.4 Quality conformance inspection, lot-by-lot tests
4.5.5 Quality conformance inspection, periodic tests
5 Blank detail specification - General
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Defines uniform specifications, type testing requirements and quality assessment procedures for a sub-family of connectors for printed board applications. Includes choice of all methods of test and sequences, severities and preferred values for dimensions and characteristics. Advises on preparation rules for detail specifications for printed board connectors of assessed quality, for use in electronic and electrical equipment. SHOULD BE READ IN CONJUNCTION WITH THE GENERIC SPECIFICATION IEC 1076 PART 1
| DevelopmentNote |
To be read in conjunction with I.S. EN 61076-1. (07/2005) For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
54
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61076-4 : 2002 | Identical |
| DIN EN 61076-4:1996-07 | Identical |
| EN 61076-4:1996 | Identical |
| SN EN 61076-4 : 1996 | Identical |
| UNE-EN 61076-4:1997 | Identical |
| IEC 61076-4:1995 | Identical |
| NBN EN 61076-4 : 1996 | Identical |
| BS EN 61076-4:1997 | Identical |
| IEC 61076-1:2006 | Connectors for electronic equipment - Product requirements - Part 1: Generic specification |
| EN 60917-2-2:1996 | Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units |
| EN 60352-2:2006/A1:2013 | SOLDERLESS CONNECTIONS - PART 2: CRIMPED CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE |
| IEC 60352-3:1993 | Solderless connections - Part 3: Solderless accessible insulation displacement connections - General requirements, test methods and practical guidance |
| EN 60352-3:1994 | Solderless connections - Part 3: Solderless accessible insulation displacement connections - General requirements, test methods and practical guidance |
| EN 61076-1:2006 | Connectors for electronic equipment - Product requirements - Part 1: Generic specification |
| IEC 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
| EN 60352-5:2012/AC:2014 | SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012) |
| IEC 60352-5:2012 | Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance |
| EN 60917:1990/A1:1994 | MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES |
| IEC 60917-2-2:1994 | Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units |
| IEC 60352-2:2006+AMD1:2013 CSV | Solderless connections - Part 2: Crimped connections - Generalrequirements, test methods and practical guidance |
| EN 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
| EN 60352-4:1994/A1:2000 | SOLDERLESS CONNECTIONS - PART 4: SOLDERLESS NON-ACCESSIBLE INSULATION DISPLACEMENT CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE |
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