I.S. EN 61188-5-5:2007
Current
The latest, up-to-date edition.
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
Hardcopy , PDF
English
01-01-2007
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 PQFP (square)
4.1 Field of application
4.2 Component descriptions
4.3 Component dimensions
4.4 Solder joint fillet design
4.5 Land pattern dimensions
5 PQFP (rectangular)
5.1 Field of application
5.2 Component descriptions
5.3 Component dimensions
5.4 Solder joint fillet design
5.5 Land pattern dimensions
6 PLQFP (square)
6.1 Field of application
6.2 Component descriptions
6.3 Component dimensions
6.4 Solder joint fillet design
6.5 Land pattern dimensions
7 PLQFP (rectangular)
7.1 Field of application
7.2 Component descriptions
7.3 Component dimensions
7.4 Solder joint fillet design
7.5 Land pattern dimensions
8 PTQFP (square)
8.1 Field of application
8.2 Component descriptions
8.3 Component dimensions
8.4 Solder joint fillet design
8.5 Land pattern dimensions
Annex ZA (normative) - Normative references to international
publications with their corresponding
European publications
Bibliography
Gives information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
54
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61188-5-5:2007 | Identical |
| BS EN 61188-5-5:2007 | Identical |
| NF EN 61188-5-5 : 2016 | Identical |
| EN 61188-5-5:2007 | Identical |
| DIN EN 61188-5-5:2008-07 | Identical |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| EN 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
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