I.S. EN 61188-5-6:2003
Current
The latest, up-to-date edition.
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
Hardcopy , PDF
English
01-01-2003
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 QFJ (square)
4.1 Introductory remark
4.2 Component description
4.3 Component dimensions
4.4 Solder joint fillet design
4.5 Land pattern dimensions
5 QFJ (rectangular)
5.1 Introductory remark
5.2 Component description
5.3 Component dimensions
5.4 Solder joint fillet design
5.5 Land pattern dimensions
Bibliography
Covers information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
51
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 61188-5-6:2003 | Identical |
| NF EN 61188-5-6 : 2003 | Identical |
| BS EN 61188-5-6:2003 | Identical |
| DIN EN 61188-5-6:2003-10 | Identical |
| IEC 61188-5-6:2003 | Identical |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| EN 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
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