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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
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Available format(s): Hardcopy, PDF
Withdrawn date: 17-01-2021
Language(s): English
Published date: 01-01-2007
Publisher: National Standards Authority of Ireland
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.Only cited Standards give presumption of conformance to New Approach Directives/Regulations.Dates of withdrawal of national standards are available from NSAI.
FOREWORD1 Scope2 Normative references3 Terms and definitions4 Classification 4.1 Alloy composition 4.2 Solder form 4.3 Flux type 4.4 Flux percentage and metal content 4.5 Other characteristics5 Requirements 5.1 Materials 5.2 Alloys 5.3 Solder forms 5.4 Flux type and form 5.5 Flux residue dryness 5.6 Spitting 5.7 Solder pool 5.8 Labelling for product identification 5.9 Workmanship6 Quality assurance provisions 6.1 Responsibility for inspection and compliance 6.2 Classification of inspections 6.3 Materials inspection 6.4 Qualification inspections 6.5 Quality conformance 6.6 Preparation of solder alloy for test7 Preparation for delivery - Preservation, packing and packagingAnnex A (informative) Selection of various alloys and fluxes for use in electronic soldering - General information concerning IEC 61190-1-3Annex B (normative) Lead-free solder alloys testsAnnex C (informative) Marking method of solder designation for mounted board, used in electronic equipmentAnnex ZA (normative) Normative references to international publications with their corresponding European publications
Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications and for 'special' electronic grade solders.
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