• DIN EN 61190-1-3:2015-05 (Draft)

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

    Available format(s):  Hardcopy, PDF

    Superseded date:  07-03-2021

    Language(s):  German

    Published date:  01-01-2015

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Classification
      3.1 Alloy composition
      3.2 Solder form
      3.3 Flux type
      3.4 Flux percentage and metal content
      3.5 Other characteristics
    4 Terms and definitions
    5 Requirements
      5.1 Materials
      5.2 Alloys
      5.3 Solder forms
      5.4 Flux type and form
      5.5 Flux residue dryness
      5.6 Spitting
      5.7 Solder-pool
      5.8 Labelling for product identification
      5.9 Workmanship
    6 Quality assurance provisions
      6.1 Responsibility for inspection and compliance
      6.2 Classification of inspections
      6.3 Material inspection
      6.4 Qualification inspection
      6.5 Quality conformance
      6.6 Preparation of solder alloy for test
    7 Preparation for delivery
      7.1 Preservation, packing, and packaging
    Annex A (informative)
      A.1 Intended use
      A.2 Acquisition requirements
      A.3 Standard solder product packages
      A.4 Protocol for establishing short names for
          IEC 61190-1-3 alloys
      A.5 Standard description of solid solder products
    Annex B (normative) Solder alloys
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications
    Bibliography

    General Product Information - (Show below) - (Hide below)

    Comment Closes On
    Development Note Supersedes DIN IEC 91-149-CD. (01/2003) Supersedes DIN IEC 61190-1-3 and DIN IEC 61190-1-3:DRAFT AMD 1 issue 11-2008. (04/2011) DRAFT 2015 issued in May 2015. (05/2015)
    Document Type Draft
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Superseded
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    VDE 0468-2-69 : 2018 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    DIN EN 60068-2-69 : 2007 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
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