Skip to content
Please enter a keyword to search

  • BS EN 61190-1-3 : 2007

    Current The latest, up-to-date edition.

    ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2007

    Publisher:  British Standards Institution

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Classification
    5 Requirements
    6 Quality assurance provisions
    7 Preparation for delivery - Preservation, packing
      and packaging
    Annex A (informative) - Selection of various alloys and
            fluxes for use in electronic soldering - General
            information concerning IEC 61190-1-3
    Annex B (normative) - Lead-free solder alloys tests
    Annex C (informative) - Marking method of solder
            designation for mounted board, used in electronic
            equipment
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Describes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, power solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Supersedes 98/231750 DC (09/2002) Supersedes 05/30133287 DC. (08/2007) 2007 Edition Re-Issued in March 2011 & incorporates AMD 1 2010. Supersedes 09/30190431 DC. (03/2011)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
    EN ISO 9454-2:2000 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    EN ISO 9001:2015 Quality management systems - Requirements (ISO 9001:2015)
    EN ISO 9453:2014 Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    EN 29454-1:1993 Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:1990)
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    EN 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
    ISO 9001:2015 Quality management systems — Requirements
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective