I.S. EN 62047-14:2012
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS (IEC 62047-14:2012 (EQV))
Hardcopy , PDF
English
01-01-2012
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FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Testing method
5 Test procedure and analysis
6 Test report
Annex A (informative) - Principles of the forming limit
diagram
Annex B (informative) - Grid marking method
Annex C (informative) - Gripping method
Annex D (informative) - Strain measuring method
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Explains definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 [mu]m to 300 [mu]m.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
23
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 62047-14:2012 | Identical |
| EN 62047-1:2016 | Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions |
| IEC 62047-1:2016 | Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions |
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