I.S. EN IEC 61760-3:2021
Current
The latest, up-to-date edition.
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021)
Hardcopy , PDF
English
30-03-2021
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Requirements to component design and component specifications
5 Typical process conditions for THR soldering process
6 Relevant tests and requirements for components and component specifications for THR soldering process
7 Quality criteria for THR soldering
Annex A (informative) Flux creeping-up and solder wicking
Bibliography
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-9294-5
|
| Pages |
72
|
| ProductNote |
The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61760-3:2021 | Identical |
| EN IEC 61760-3:2021 | Identical |
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