I.S. EN ISO 9455-14:2017
Current
The latest, up-to-date edition.
SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017)
Hardcopy , PDF
English
01-01-2017
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National Foreword
European foreword
Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Principle
5 Reagents and materials
6 Apparatus
7 Test pieces
8 Procedure
9 Examination of the test piece
10 Expression of results
11 Test report
Defines a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. Pertains to all fluxes, solder pastes and flux cored solder wires.
| DevelopmentNote |
Supersedes I.S. EN 29455-14. (10/2017)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN ISO 9455-14:2017 | Identical |
| ISO 9455-14:2017 | Identical |
| ISO 197-1:1983 | Copper and copper alloys — Terms and definitions — Part 1: Materials |
| ISO 9455-2:1993 | Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method |
| ISO 9455-1:1990 | Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
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