IEC 60050-541:1990
Current
The latest, up-to-date edition.
International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
15-10-1990
Foreword
Preface
541-01 General terms
541-02 Base material
541-03 Conception - Artwork master
541-04 Manufacturing
It has the status of a horizontal standard in accordance with IEC Guide 108.
Committee |
TC 1
|
DocumentType |
Standard
|
Pages |
32
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Standards | Relationship |
NEN IEC 60050-541 : 1991 AMD 1 2015 | Identical |
PN IEC 60050-541 : 2003 | Identical |
NEN 10050-541 : 1991 | Identical |
UNE 21302-541:1992 | Identical |
NFC 01 541 : 1992 AMD 1 2015 | Identical |
I.S. EN 60194:2006 | PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS |
IEC 60139:2000 | Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges |
BS EN 60194:2006 | Printed board design, manufacture and assembly. Terms and definitions |
CEI EN 60194 : 2009 | PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS |
I.S. EN ISO 10303-210:2002 | INDUSTRIAL AUTOMATION SYSTEMS AND INTEGRATION - PRODUCT DATA REPRESENTATION AND EXCHANGE - PART 210: APPLICATION PROTOCOL: ELECTRONIC ASSEMBLY, INTERCONNECTION, AND PACKAGING DESIGN |
05/30141770 DC : DRAFT NOV 2005 | |
IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
EN ISO 10303-210:2002 | Industrial automation systems and integration - Product data representation and exchange - Part 210: Application protocol: Electronic assembly, interconnection, and packaging design (ISO 10303-210:2001) |
EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
EN 60139:2001 | Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges |
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