IEC 60191-3A:1976
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-09-2022
English - French, Russian
01-01-1976
Important note : Users cannot be edited or removed once added to your Multi user PDF.Deals with design procedure for dimensions of integrated circuit packages, and rules for mounting integrated circuit packages into carriers.
| Committee |
TC 47/SC 47D
|
| DocumentType |
Standard
|
| Pages |
11
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| Standards | Relationship |
| BS 3934:Addendum No. 6:1989 | Similar to |
| NEN 10191-3 : 91 AMD 2 97 | Identical |
| BS 3934:1965 | Similar to |
| CEI 47-7 : 1ED 1981 | Identical |
| BS QC 763000(1990) : AMD 6754 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.