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  • IEC 60191-6-18:2010/COR1:2010

    Current The latest, up-to-date edition.

    Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  31-05-2010

    Publisher:  International Electrotechnical Committee

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    Committee TC 47/SC 47D
    Document Type Corrigendum
    Publisher International Electrotechnical Committee
    Status Current
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