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  • IEC PAS 60191-6-18:2008

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  07-01-2010

    Language(s):  English

    Published date:  22-01-2008

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Terminal position numbering
    5 Nominal package dimension
    6 Symbols and drawings
      6.1 BGA outline
    7 Dimensions
      7.1 Group 1
      7.2 Group 2
    8 Recommended BGA variations

    Abstract - (Show below) - (Hide below)

    This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.

    General Product Information - (Show below) - (Hide below)

    Document Type Miscellaneous Product
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
    IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
    IEC 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
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