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BS EN 60191-6-18:2010

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-10-2010

€231.38
Excluding VAT

1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Symbols and drawings
7 Dimensions
8 Recommended BGA variations
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Gives standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

Committee
EPL/47
DevelopmentNote
Supersedes 08/30175763 DC. (04/2010)
DocumentType
Standard
Pages
24
PublisherName
British Standards Institution
Status
Current
Supersedes

This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

Standards Relationship
EN 60191-6-18:2010 Identical
IEC 60191-6-18:2010 Identical
IEC 60191-6-18:2010/COR1:2010 Identical

EN 60191-6-2:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

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