IEC 60191-6-22:2012
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
11-12-2012
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Code of package nominal dimensions
6 Symbols and drawings
7 Dimensions
8 Combination list of D, E, M[D], and M[E]
Bibliography
IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Stability date: 2022. (12/2012)
|
| DocumentType |
Standard
|
| Pages |
34
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60191-6-22 : 2013 | Identical |
| NEN EN IEC 60191-6-22 : 2013 | Identical |
| PN EN 60191-6-22 : 2013 | Identical |
| BS EN 60191-6-22:2013 | Identical |
| CEI EN 60191-6-22 : 2014 | Identical |
| EN 60191-6-22:2013 | Identical |
| DIN EN 60191-6-22:2013-08 | Identical |
| SN EN 60191-6-22:2013 | Identical |
| PNE-FprEN 60191-6-22 | Identical |
| UNE-EN 60191-6-22:2013 | Identical |
| 17/30361860 DC : DRAFT JUL 2017 | BS EN 62148-21 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 21: DESIGN GUIDE OF ELECTRICAL INTERFACE OF PIC PACKAGES USING SILICON FINE-PITCH BALL GRID ARRAY (S-FBGA) AND SILICON FINE-PITCH LAND GRID ARRAY (S-FLGA) |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60191-6-12:2011 | Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) |
| IEC 60191-6-5:2001 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
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