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IEC 60191-6-22:2012
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The latest, up-to-date edition.
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Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
11-12-2012
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Code of package nominal dimensions
6 Symbols and drawings
7 Dimensions
8 Combination list of D, E, M[D], and M[E]
Bibliography
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