• IEC 60384-10:1989

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    Fixed capacitors for use in electronic equipment. Part 10: Sectional specification: Fixed multilayer ceramic chip capacitors

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  24-06-2004

    Language(s): 

    Published date:  15-04-1989

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    PREFACE
    SECTION ONE - GENERAL
    Clause
    1 General
      1.1 Scope
      1.2 Object
      1.3 Related documents
      1.4 Information to be given in a detail specification
      1.5 Terminology
      1.6 Marking
    SECTION TWO - PREFERRED RATINGS AND CHARACTERISTICS
    2 Preferred ratings and characteristics
      2.1 Preferred characteristics
      2.2 Preferred values of ratings
    SECTION THREE - QUALITY ASSESSMENT PROCEDURES
    3 Quality assessment procedures
      3.1 Primary Stage of Manufacture
      3.2 Structurally Similar Components
      3.3 Certified Records of Released Lots
      3.4 Qualification Approval
      3.5 Quality Conformance Inspection
    SECTION FOUR - TEST AND MEASUREMENT PROCEDURES
    4 Test and measurement procedures
      4.1 Special preconditioning
      4.2 Preliminary drying
      4.3 Measuring conditions
      4.4 Mounting
      4.5 Visual examination and check of dimensions
      4.6 Electrical tests
      4.7 Variation of capacitance with temperature
      4.8 Adhesion
      4.9 Bond strength of the end face plating
      4.10 Resistance to soldering heat
      4.11 Solderability
      4.12 Rapid change of temperature
      4.13 Climatic sequence
      4.14 Damp heat, steady state
      4.15 Endurance
      4.16 Robustness of terminations (Only for capacitors
           with strip terminations)
      4.17 Component solvent resistance
      4.18 Solvent resistance of the marking
    Appendix A - Guide for the specification and coding of
                 selecting dimensions of multilayer ceramic
                 chip capacitors
    Appendix B - Capacitance ageing of fixed capacitors of
                 ceramic dielectric, Class 2

    Abstract - (Show below) - (Hide below)

    Applicable to fixed unencapsulated multilayer chip capacitors ofceramic dielectric, Class 1 and Class 2, with a rated voltagenormally not exceeding 200 V, for use in electronic equipment. Thesecapacitors have metallized connecting pads or soldering strips andare intended to be mounted directly on to substrates for hybridcircuits or on to printed boards.

    General Product Information - (Show below) - (Hide below)

    Committee TC 40
    Development Note Also numbered as BS QC301900(1992) (08/2005)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    96/209014 DC : DRAFT JUL 1996 PREN 132900 - SECTIONAL SPECIFICATION - HIGH VOLTAGE CERAMIC CAPACITORS
    BS QC300600(1991) : 1991 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - SECTIONAL SPECIFICATION FOR FIXED CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1
    I.S. EN 61188-5-2:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    BS QC300700(1992) : 1992 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - SECTIONAL SPECIFICATION FOR FIXED CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2
    BS EN 132100 : 1997 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: FIXED MULTILAYER CERAMIC SURFACE MOUNTING CAPACITORS - ASSESSMENT LEVELS EZ AND DZ
    BS EN 61188-5-2 : 2003 PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    EN 61188-5-2 : 2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
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