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IEC 61188-5-2:2003

Current

Current

The latest, up-to-date edition.

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

24-06-2003

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Packaging
4 Fixed rectangular chip resistors
   4.1 Introductory remark
   4.2 Component description
   4.3 Component dimensions
   4.4 Solder joint fillet design
   4.5 Land pattern dimensions
5 Fixed cylindrical chip resistors
   5.1 Introductory remark
   5.2 Component description
   5.3 Component dimensions
   5.4 Solder joint fillet design
   5.5 Land pattern dimensions
6 Fixed multilayer ceramic chip capacitors
   6.1 Introductory remark
   6.2 Component description
   6.3 Component dimensions
   6.4 Solder joint fillet design
   6.5 Land pattern dimensions
7 Fixed tantalum chip capacitors
   7.1 Introductory remark
   7.2 Component description
   7.3 Component dimensions
   7.4 Solder joint fillet design
   7.5 Land pattern dimensions
8 Fixed aluminium electrolytic chip capacitors with non-solid
   electrolyte (vertical type)
   8.1 Introductory remark
   8.2 Component description
   8.3 Component dimensions
   8.4 Solder joint fillet design
   8.5 Land pattern dimensions
9 Fixed aluminium electrolytic chip capacitors with non-solid
   electrolyte (horizontal type)
   9.1 Introductory remark
   9.2 Component description
   9.3 Component dimensions
   9.4 Solder joint fillet design
   9.5 Land pattern dimensions
10 Fixed film chip capacitors
   10.1 Introductory remark
   10.2 Component description
   10.3 Component dimensions
   10.4 Solder joint fillet design
   10.5 Land pattern dimensions
11 Fixed chip inductors (multilayer type)
   11.1 Introductory remark
   11.2 Component description
   11.3 Component dimensions
   11.4 Solder joint fillet design
   11.5 Land pattern dimensions
12 Fixed chip inductors (wire wound type)
13 SC-59/TO-236 - Transistors
14 SC-62/TO-243 - Transistors
15 SC-61/TO-253 - Transistors
16 SC-73 - Diodes
17 SC-63/TO-252 - Transistors
18 SC-77 - Transistors
Bibliography

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

Committee
TC 91
DevelopmentNote
To be read in conjunction with IEC 61188-5-1. (06/2003) Stability Date: 2017. (09/2017)
DocumentType
Standard
Pages
103
PublisherName
International Electrotechnical Committee
Status
Current

BS EN 61182-2-2:2012 Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
05/30133599 DC : DRAFT MAY 2005 IEC 62137-1-2 - SURFACE MOUNT TECHNOLOGY - ENVIRONMENTAL ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
16/30333621 DC : 0 BS EN 61188-7 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION
BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
NF EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
EN 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
17/30352677 DC : 0 BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN
BS ISO 16525-9:2014 Adhesives. Test methods for isotropic electrically conductive adhesives Determination of high-speed signal-transmission characteristics
I.S. EN 62137-1-2:2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
BS EN 62137-1-2:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
07/30169578 DC : 0 BS EN 61188-7 - PRINTED BOARD AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: SECTIONAL REQUIREMENTS - ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION
05/30129049 DC : DRAFT FEB 2005 IEC 62025-2 - HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
BS EN 62025-2:2005 High frequency inductive components. Non-electrical characteristics and measuring methods Test methods for non-electrical characteristics
I.S. EN 61182-2-2:2012 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))
BS EN 61191-4:2017 Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
ISO 16525-9:2014 Adhesives Test methods for isotropic electrically conductive adhesives Part 9: Determination of high-speed signal-transmission characteristics
IEC 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
BS IEC 61182-2:2006 Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 62025-2:2005 High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics
I.S. EN 62025-2:2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
CEI EN 62137-1-2 : 2008 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
OVE/ONORM EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
EN 62025-2:2005 High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics

IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 61605:2016 Fixed inductors for use in electronic and telecommunication equipment - Marking codes
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IEC 60384-20:2015 Fixed capacitors for use in electronic equipment - Part 20: Sectional specification - Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors
IEC 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
IEC 60384-10:1989 Fixed capacitors for use in electronic equipment. Part 10: Sectional specification: Fixed multilayer ceramic chip capacitors
IEC 60286-5:2003+AMD1:2009 CSV Packaging of components for automatic handling - Part 5: Matrixtrays
IEC 60384-3:2016 Fixed capacitors for use in electronic equipment - Part 3: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with solid (MnO<sub>2</sub>) electrolyte
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 60051:1973 Recommendations for direct acting indicating electrical measuring instruments and their accessories
IEC 60384-18:2016 Fixed capacitors for use in electronic equipment - Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO<sub>2</sub>) and non-solid electrolyte
IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
IEC 60115-8:2009 Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
IPC SM 782 : A1993 AMD 2 1999 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
IEC 60115-1:2008 Fixed resistors for use in electronic equipment - Part 1: Generic specification

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