Skip to content
Please enter a keyword to search

  • IEC 60512-11-5:2002

    Current The latest, up-to-date edition.

    Connectors for electronic equipment - Tests and measurements - Part 11-5: Climatic tests - Test 11e: Mould growth

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French, Spanish, Castilian

    Published date:  21-02-2002

    Publisher:  International Electrotechnical Committee

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    Foreword
    1 General
    2 Preparation
    3 Test method
    4 Details to be specified

    Abstract - (Show below) - (Hide below)

    Defines a standard test method to assess the extent and the effect of mould growth on the functioning of a component (essentially a connector) submitted to a mould culture.

    General Product Information - (Show below) - (Hide below)

    Committee TC 48/SC 48B
    Development Note Stability Date: 2017. (10/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    03/100395 DC : DRAFT APR 2003 EN 175101-809 - DETAIL SPECIFICATION - TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2,54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75 101-801, WITH ASSESSED QUALITY
    EN 175101-809:2004/corrigendum Jun. 2005 DETAIL SPECIFICATION: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2,54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75 101-801, WITH ASSESSED QUALITY
    BS EN 175101-809:2004 Harmonized system of quality assessment for electronic components. Detail specification Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality
    I.S. EN 175101-809:2004 DETAIL SPECIFICATION - TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2.54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75101-801, WITH ASSESSED QUALITY
    ISO/IEC 24739-3:2010 Information technology AT Attachment with Packet Interface - 7 Part 3: Serial transport protocols and physical interconnect (ATA/ATAPI-7 V3)

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60512-3-1:2002 Connectors for electronic equipment - Tests and measurements - Part 3-1: Insulation tests - Test 3a: Insulation resistance
    IEC 60512-1-1:2002 Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination
    IEC 60068-2-10:2005 Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth
    EN 60512-3-1:2002 Connectors for electronic equipment - Tests and measurements - Part 3-1: Insulation tests - Test 3a: Insulation resistance
    HD 323.2.10 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST J AND GUIDANCE: MOULD GROWTH
    EN 60512-1-1:2002 Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective