IEC 60512-12-7:2001
Current
The latest, up-to-date edition.
Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French, Spanish, Castilian
24-01-2001
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FOREWORD
1 Scope and object
2 Normative references
3 Preparation of the specimen
4 Procedure
4.1 Accelerated ageing
4.2 Flux
5 Final measurement
6 Requirements
7 Details to be specified
Defines a standard test method to assess the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.
| Committee |
TC 48/SC 48B
|
| DevelopmentNote |
Also numbered as BS EN 60512-12-7. (08/2001) Stability Date: 2017. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
7
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| I.S. EN 60512-12-7:2001 | Identical |
| NF EN 60512-12-7 : 2002 | Identical |
| CEI EN 60512-12-7 : 2002 | Identical |
| PN EN 60512-12-7 : 2002 | Identical |
| DIN EN 60512-12-7:2001-11 | Identical |
| NEN EN IEC 60512-12-7 : 2001 | Identical |
| SN EN 60512-12-7 : 2001 | Identical |
| UNE-EN 60512-12-7:2002 | Identical |
| JIS C 5402-12-7:2005 | Identical |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
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