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  • IEC 60603-12:1992

    Current The latest, up-to-date edition.

    Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  25-06-1992

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    Clause
    1 Scope
    2 Normative references
    3 IEC type designation
    4 Common features
    5 Dimensions
    6 Characteristics
    7 Test schedule
    8 Dual-in-line sockets with solder termination for
       through-board insertion (standard type)
    9 Dual-in-line sockets with solderless wire wrapping
       terminations for through-board insertion (standard
       type)
    10 Dual-in-line sockets with solder terminations for
       through-board insertion (low-profile type)
    11 Dual-in-line sockets with solderless wire wrapping
       terminations for through-board insertion (low-profile
       type)
    12 Individual contact retention force gauge
    13 Socket gauges

    Abstract - (Show below) - (Hide below)

    Covers dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits in dual-in-line format. Sockets include standard type and low-profile type.

    General Product Information - (Show below) - (Hide below)

    Committee TC 48/SC 48B
    Development Note Also numbered as BS EN 60603-12. (11/2005) Stability Date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    I.S. EN IEC 62148-1:2018 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 1: GENERAL AND GUIDANCE
    EN IEC 62148-1:2018 Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance
    IEC 62148-1:2017 Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60512-6:1984 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests
    IEC 60512-7:1993 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests
    IEC 60097:1991 Grid systems for printed circuits
    IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
    ISO 468:1982 Surface roughness — Parameters, their values and general rules for specifying requirements
    IEC 60512-4:1976 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests
    IEC 60512-5:1992 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests
    IEC 60512-3:1976 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests
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