IEC 60747-5-6:2016
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
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31-12-2021
English - French
23-02-2016
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Absolute maximum ratings
5 Electrical and optical characteristics
6 Measuring method
7 Items to be indicated on the package
8 Quality evaluation
Annex A (normative) - Standard luminous efficiency
Annex B (normative) - How to obtain the self-absorption
correction factor
Annex C (normative) - How to obtain the colour
correction factor
Annex D (normative) - Calibration of the luminance
meter
Annex E (normative) - Colour-matching function of
the XYZ colour system
Annex F (normative) - Spectral chromaticity coordinates
Annex G (normative) - Illuminometer calibration
Bibliography
IEC 60747-5-6:2016 specifies the terminology, the essential ratings and characteristics, the measuring methods and the quality evaluations of light emitting diodes (LEDs) for general industrial applications such as signals, controllers, sensors, etc. LEDs for lighting applications are out of the scope of this part of IEC 60747. The types of LED are divided into the following five classes:
a) LED package;
b) LED flat illuminator;
c) LED numeric display and alpha-numeric display;
d) LED dot-matrix display;
e) I LED (infrared-emitting diode).
LEDs with a heat spreader or having a terminal geometry that performs the function of a heat spreader are within the scope of this part of IEC 60747. An integration of LEDs and controlgears, integrated LED modules, semi-integrated LED modules, integrated LED lamps or semi-integrated LED lamps, are out of the scope of this part of IEC 60747. This first edition of IEC 60747-5-6, together with IEC 60747-5-4, IEC 60747-5-5 and IEC 60747-5-7, cancels and replaces IEC 60747-5-1, IEC 60747-5-2 and IEC 60747-5-3, published in 1997, and their amendments. This edition constitutes a technical revision. This edition includes significant technical changes to the clauses for light emitting diodes in IEC 60747-5-1:1997, IEC 60747-5-2:1997 and IEC 60747-5-3:1997, including their amendments.
| Committee |
TC 47/SC 47E
|
| DevelopmentNote |
Supersedes IEC 60747-5-1, IEC 60747-5-2 and IEC 60747-5-3. Stability date: 2018. (02/2016)
|
| DocumentType |
Standard
|
| Pages |
168
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IEC 60747-5-7:2016 | Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| IEC 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
| ISO 2859:1974 | Sampling procedures and tables for inspection by attributes |
| IEC 60749-36:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state |
| IEC 60050-845:1987 | International Electrotechnical Vocabulary (IEV) - Part 845: Lighting |
| IEC 60749-24:2004 | Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST |
| IEC 60749-15:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| IEC 62504:2014 | General lighting - Light emitting diode (LED) products and related equipment - Terms and definitions |
| IEC 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
| IEC 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
| IEC 60749-14:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) |
| IEC 60664-1:2007 | Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests |
| IEC 60749-12:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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