IEC 60749-39:2006
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
29-11-2021
English - French
24-07-2006
Important note : Users cannot be edited or removed once added to your Multi user PDF.Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62307 (07/2006) Stability Date: 2021. (11/2017)
|
| DocumentType |
Standard
|
| Pages |
19
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| NF EN 60749-39 : 2006 | Identical |
| NEN EN IEC 60749-39 : 2007 | Identical |
| I.S. EN 60749-39:2006 | Identical |
| PN EN 60749-39 : 2008 | Identical |
| UNE-EN 60749-39:2006 | Identical |
| BS EN 60749-39:2006 | Identical |
| CEI EN 60749-39 : 2007 | Identical |
| EN 60749-39 : 2006 | Identical |
| DIN EN 60749-39:2007-01 | Identical |
| PNE-prEN 60749-39 | Identical |
| EN 60749-20-1 : 2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| BS EN 60749-20-1:2009 | Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| I.S. EN 60749-20-1:2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
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