IEC 61337-1-2:1999
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Filters using waveguide type dielectric resonators - Part 1-2: Test conditions
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
02-11-2004
English - French
17-06-1999
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FOREWORD
1 Scope and object
2 Normative references
3 Standard conditions for testing
4 Visual examination and check of dimensions
5 Transmission characteristics
5.1 Measuring methods
5.2 Measurement conditions
6 Insulation resistance
7 Voltage proof
8 Power capability
9 Storage test
10 High temperature ageing
11 Strength of terminations
11.1 Tensile test and thrust test
11.2 Bend test
11.3 Torque test
12 Soldering
12.1 Resistance to soldering heat and to dissolution
of metallization
12.2 Solderability of terminations
13 Rapid change of temperature
14 Bump
15 Vibration
16 Shock
17 Acceleration, steady state
18 Climatic sequence
18.1 Dry heat
18.2 Damp heat, cyclic
18.3 Cold
19 Damp heat, steady state
20 Low air pressure
Annex A (normative) General recommendations for type approval
test
Figure 1 - Insertion attenuation and group delay measurement
Figure 2 - Return attenuation measurement
Describes the test conditions for filters using waveguide type dielectric resonators. Details the measuring methods, mechanical and climatic tests, and tests for assessing the ability of the filter to maintain its electrical characteristics.
| DocumentType |
Standard
|
| Pages |
27
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| I.S. EN 61337-2:2004 | FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE |
| BS EN 61337-2:2004 | Filters using waveguide type dielectric resonators Guide for use |
| IEC 61337-2:2004 | Filters using waveguide type dielectric resonators - Part 2: Guidance for use |
| EN 61337-2:2004 | Filters using waveguide type dielectric resonators - Part 2: Guidance for use |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60068-2-29:1987 | Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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