IEC 61338-1-2:1998
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Waveguide type dielectric resonators - Part 1-2: General information and test conditions - Test conditions
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
02-11-2004
English - French
24-07-1998
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Scope and object
2 Normative references
3 Standard conditions for testing
4 Visual examination and dimension control
5 Electrical characteristics
6 Storage test
7 High temperature ageing
8 Strength of terminations
9 Soldering
10 Rapid change of temperature
11 Bump
12 Vibration
13 Shock
14 Acceleration, steady state
15 Climatic test
16 Damp heat, steady state
17 Low air pressure
Figures
1 Transmission measurement
2 Resonator test fixtures
3 Frequency response for test fixtures A, B and D
4 Frequency response for test fixture C
Annex A General recommendations for type approval tests
Gives details of measurement methods and of tests for assessing the ability of the resonator to maintain its electrical characteristics after a certain period of use.
| DocumentType |
Standard
|
| Pages |
33
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| BS EN 61338-2:2004 | Waveguide type dielectric resonators Guidelines for oscillator and filter applications |
| IEC 61338-2:2004 | Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications |
| IEC PAS 61338-2:2000 | Waveguide type dielectric resonators - Part 2: Guide to the use of waveguide type dielectric resonators |
| EN 61338-2:2004 | Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60068-2-29:1987 | Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 61338-1-3:1999 | Waveguide type dielectric resonators - Part 1-3: General information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at microwave frequency |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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