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IEC 62047-12:2011

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

13-09-2011

€197.53
Excluding VAT

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Specimen
6 Test conditions
7 Initial measurement
8 Test
9 Test report
Annex A (informative) - Example of testing using an
        electrostatic device with an integrated actuation
        component and displacement detection component
Annex B (informative) - Example of testing using an
        external drive and a device with an integrated strain
        gauge for detecting displacement
Annex C (informative) - Example of electromagnetic
        drive out-of-plane vibration test (external drive
        vibration test)
Annex D (informative) - Theoretical expression on
        fatigue life of brittle materials based on Paris' law
        and Weibull distribution
Annex E (informative) - Analysis examples
Bibliography

IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 μm to 1 000 μm in the plane direction and from 1 μm to 100 μm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 μm and 10 μm in thickness. The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration.

DevelopmentNote
Stability date: 2018. (09/2017)
DocumentType
Standard
Pages
59
PublisherName
International Electrotechnical Committee
Status
Current

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
ISO 12107:2012 Metallic materials — Fatigue testing — Statistical planning and analysis of data

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