IEC 62047-12:2011
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
13-09-2011
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Specimen
6 Test conditions
7 Initial measurement
8 Test
9 Test report
Annex A (informative) - Example of testing using an
electrostatic device with an integrated actuation
component and displacement detection component
Annex B (informative) - Example of testing using an
external drive and a device with an integrated strain
gauge for detecting displacement
Annex C (informative) - Example of electromagnetic
drive out-of-plane vibration test (external drive
vibration test)
Annex D (informative) - Theoretical expression on
fatigue life of brittle materials based on Paris' law
and Weibull distribution
Annex E (informative) - Analysis examples
Bibliography
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.