IEC 62047-22:2014
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
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English - French
19-06-2014
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FOREWORD
1 Scope
2 Normative references
3 Terms, definitions, symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
IEC 62047-22:2014 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.
| Committee |
TC 47/SC 47F
|
| DevelopmentNote |
Stability date: 2017. (06/2014)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| SN EN 62047-22:2014 | Identical |
| NF EN 62047-22 : 2014 | Identical |
| NBN EN 62047-22 : 2014 | Identical |
| NEN EN IEC 62047-22 : 2014 | Identical |
| PN EN 62047-22 : 2014 | Identical |
| UNE-EN 62047-22:2014 | Identical |
| BS EN 62047-22:2014 | Identical |
| CEI EN 62047-22 : 2016 | Identical |
| EN 62047-22:2014 | Identical |
| DIN EN 62047-22:2015-04 | Identical |
| PNE-FprEN 62047-22 | Identical |
| 17/30352696 DC : DRAFT SEP 2017 | BS IEC 62047-31 ED1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 31: FOUR-POINT BENDING TEST METHOD FOR INTERFACIAL ADHESION ENERGY OF LAYERED MEMS MATERIALS |
| IEC 62047-29:2017 | Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature |
| 15/30319018 DC : 0 | BS EN 62951-1 ED 1.0 - SEMICONDUCTOR DEVICES - FLEXIBLE AND STRETCHABLE SEMICONDUCTOR DEVICES - PART 1: BENDING TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES |
| IEC 62951-1:2017 | Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| IEC 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
| IEC 62047-3:2006 | Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing |
| ISO 527-3:1995 | Plastics Determination of tensile properties Part 3: Test conditions for films and sheets |
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