IEC 62047-30:2017
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
15-09-2017
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test bed of MEMS piezoelectric thin film
5 Thin film under testing
6 Test report
Annex A (informative) - Example of measuring method
of MEMS piezoelectric thin film
Bibliography
IEC 62047-30:2017(E) specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film used for micro sensors and micro actuators, and its reporting schema to determine the characteristic parameters for consumer, industry or any other applications of piezoelectric devices. This document applies to piezoelectric thin films fabricated by MEMS process
| DevelopmentNote |
Stability Date: 2022. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN IEC 62047-30 : 2017 | Identical |
| JIS C 5630-30:2020 | Identical |
| BS IEC 62047-30:2017 | Identical |
| 17/30363044 DC : 0 | BS EN 62047-36 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 36: ENVIRONMENTAL AND DIELECTRIC WITHSTAND TEST METHODS FOR MEMS PIEZOELECTRIC THIN FILMS |
| EN 50324-2:2002 | Piezoelectric properties of ceramic materials and components - Part 2: Methods of measurement - Low power |
| IEC 60483:1976 | Guide to dynamic measurements of piezoelectric ceramics with high electromechanical coupling |
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