IEC PAS 60191-6-19:2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
25-02-2010
English
22-01-2008
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Sample
4.1 Sample size
4.2 Solder ball removal
4.3 Pre-treatment conditions
4.4 Maximum time after pretreatment until measurement
4.5 Repetition of the reflow cycles for the sample
5 Measurement
5.1 General description
5.2 Temperature profile and the temperatures for measurements
5.3 Measurement method
6 Maximum permissible package warpage at elevated temperature
7 Recommended datasheet for the package warpage
7.1 Measurement temperatures for data sheet
7.2 Data sheet
7.3 Example of data sheets
Annex A (informative) Explanatory notes
Bibliography
This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.
| DocumentType |
Miscellaneous Product
|
| Pages |
22
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NEN NPR IEC/PAS 60191-6-19 : 2008 | Identical |
| BS EN 60191-6-19:2010 | Identical |
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