IEC TS 62878-2-3:2015
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Device embedded substrate - Part 2-3: Guidelines - Design guide |
EN ISO 15184:2012
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Paints and varnishes - Determination of film hardness by pencil test (ISO 15184:2012) |
IEC 61189-11:2013
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
IEC 62421:2007
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Electronics assembly technology - Electronic modules |
IEC TS 62878-2-1:2015
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Device embedded substrate - Part 2-1: Guidelines - General description of technology |
IEC 60068-1:2013
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Environmental testing - Part 1: General and guidance |
IEC TR 62866:2014
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Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
IEC 60068-2-58:2015+AMD1:2017 CSV
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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
EN 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC TS 62878-2-4:2015
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Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG) |
EN 60068-2-1:2007
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Environmental testing - Part 2-1: Tests - Test A: Cold |
IEC 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
EN 60068-2-2:2007
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Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC 60068-2-21:2006
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Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
EN 60068-1:2014
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Environmental testing - Part 1: General and guidance |
EN ISO 9445-1:2010
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Continuously cold-rolled stainless steel - Tolerances on dimensions and form - Part 1: Narrow strip and cut lengths (ISO 9445-1:2009) |
EN 60068-2-64:2008
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ENVIRONMENTAL TESTING - PART 2-64: TESTS - TEST FH: VIBRATION, BROADBAND RANDOM AND GUIDANCE |
EN ISO 2409:2013
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Paints and varnishes - Cross-cut test (ISO 2409:2013) |
ISO 3366:1999
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Coated abrasives Abrasive rolls |
IEC 62137-1-3:2008
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Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
IEC 60068-2-66:1994
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Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
ISO 4957:1999
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Tool steels |
EN 61189-11 : 2013
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS |
IEC 61189-1:1997+AMD1:2001 CSV
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Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
ISO 9454-1:2016
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Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
IEC 60068-2-64:2008
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Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance |
IEC 60068-2-53:2010
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Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests |
ISO 15184:2012
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Paints and varnishes Determination of film hardness by pencil test |
EN ISO 4957:1999
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Tool steels (ISO 4957:1999) |
IEC 60068-2-38:2009
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Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
EN 61189-3:2008
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
ISO 6906:1984
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Vernier callipers reading to 0,02 mm |
ISO 29864:2007
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Self adhesive tapes Measurement of breaking strength and elongation at break |
ISO 9180:1988
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Black leads for wood-cased pencils Classification and diameters |
EN ISO 9453:2014
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Soft solder alloys - Chemical compositions and forms (ISO 9453:2014) |
EN 60068-2-38:2009
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Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
ISO 6353-3:1987
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Reagents for chemical analysis — Part 3: Specifications — Second series |
IEC 61189-3:2007
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
ISO 29863:2007
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Self adhesive tapes Measurement of static shear adhesion |
IEC 62137-1-2:2007
|
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
ISO 29862:2007
|
Self adhesive tapes Determination of peel adhesion properties |
ISO 3599:1976
|
Vernier callipers reading to 0,1 and 0,05 mm |
EN 60068-2-21:2006
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Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 60068-2-2:2007
|
Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC 60194:2015
|
Printed board design, manufacture and assembly - Terms and definitions |
ISO 8512-1:1990
|
Surface plates — Part 1: Cast iron |
ISO 291:2008
|
Plastics Standard atmospheres for conditioning and testing |
EN ISO 3611:2010
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Geometrical product specifications (GPS) - Dimensional measuring equipment: Micrometers for external measurements - Design and metrological characteristics (ISO 3611:2010) |
IEC 60068-2-80:2005
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Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode |
ISO 3611:2010
|
Geometrical product specifications (GPS) — Dimensional measuring equipment: Micrometers for external measurements — Design and metrological characteristics |
ISO 9453:2014
|
Soft solder alloys Chemical compositions and forms |
EN 60068-2-78:2013
|
Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
EN ISO 291:2008
|
Plastics - Standard atmospheres for conditioning and testing (ISO 291:2008) |
EN 60068-2-6:2008
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Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
EN 61189-1 : 97 AMD 1 2001
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY |
EN 62137-1-3:2009
|
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
ISO 8512-2:1990
|
Surface plates — Part 2: Granite |
EN 62137-1-2:2007
|
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
EN 60068-2-66:1994
|
Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
ISO 21948:2001
|
Coated abrasives Plain sheets |
IEC 60068-2-1:2007
|
Environmental testing - Part 2-1: Tests - Test A: Cold |
EN 61190-1-3:2007/A1:2010
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
EN 60068-2-30:2005
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Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
ISO 2409:2013
|
Paints and varnishes Cross-cut test |
IEC 60068-2-14:2009
|
Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
EN 61190-1-2:2014
|
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
ISO 9445-1:2009
|
Continuously cold-rolled stainless steel Tolerances on dimensions and form Part 1: Narrow strip and cut lengths |
EN 60068-2-14:2009
|
Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
IEC 61189-2:2006
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
EN 60068-2-53:2010
|
Environmental testing - Part 2-53: Tests and guidance: Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests |
EN 60194:2006
|
Printed board design, manufacture and assembly - Terms and definitions |
IEC 61190-1-3:2007+AMD1:2010 CSV
|
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
EN 61189-2:2006
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
EN 62421:2007
|
Electronics assembly technology - Electronic modules |
IEC 60068-2-30:2005
|
Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
EN 60068-2-80:2005
|
Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode |