IPC 2584 : 2007
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION
Hardcopy
13-09-2023
English
19-02-2021
1 SCOPE
1.1 Intent
1.2 Interpretation
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
3.1 Terms and Definitions
3.2 Categories and Content
4 GENERAL RULES
4.1 File Content Descriptions
4.2 Logistic Descriptions
4.3 File History Descriptions
4.3.1 HistoryRecord Use Case - Initial Design Release
4.3.2 Supply Chain Modifications
4.3.3 OEM Reviews Modifications
4.4 BOM (Board Fabrication Materials)
4.5 AVL (Board Material Suppliers)
4.6 Documentation Layers
4.6.1 Documentation Layer Restrictions
4.6.2 Reference to IPC-2614
4.6.3 Step Usage
4.6.4 Set
4.7 Design for eXcellence (Dfx) Analysis
4.7.1 DfxMeasurement
4.8 Miscellaneous Image Layers
4.8.1 Step usage
4.9 Packages and Land Patterns
4.9.1 Step Usage for Component Packages and Land
Patterns
4.9.2 Land Pattern Details
4.10 Solder Mask and Legend Layers
4.10.1 Solder Mask Details
4.10.2 Legend details
4.10.3 Step Usage for Solder Mask and Legend Layers
4.11 Drilling and Routing (Tooling) Layers
4.11.1 Drilling Details
4.11.2 Routing Details
4.11.3 Step Usage for Drilling and Routing
4.12 Net List
4.12.1 Step Usage for Net List
4.13 Outer Conductive Layers
4.13.1 Outer Conductive Layer Details
4.13.2 Step Usage for Outer Conductive Layers
4.14 Inner Conductive Layers
4.14.1 Inner Conductive Layer Details
4.14.2 Step Usage for Inner Conductive Layers
4.15 Board Construction
4.15.1 Board Construction Details
4.15.2 Step Usage for Board Construction
5 MODELING
5.1 Information Models
6 REPORT GENERATORS
6.1 Hole Usage Report
6.2 Pad Usage Report
6.3 Conductor Usage Report
7 REFERENCE INFORMATION
7.1 IPC
7.2 American National Standards Institute
7.3 Department of Defense
7.4 Electronic Industries Association
7.5 International Electrotechnical Commission (IEC)
7.6 International Organization for Standards (ISO)
APPENDIX A - PRINTED BOARD FABRICATION SCHEMA
Specifies the XML schema that represents the intelligent data file format used to describe printed board fabrication data description. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility.
| DevelopmentNote |
IPC 2581 is a mandatory part of this standard. (08/2007)
|
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| ANSI Y14.5 : 1973 | DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
| IPC 2582 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
| IPC 2614 : 0 | SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION |
| IPC 2583 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION |
| ANSI Z210.1 : LATEST | METRIC PRACTICE GUIDE |
| ANSI INCITS TR 1 : 1982 | DICTIONARY FOR INFORMATION PROCESSING - AMERICAN NATIONAL |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC 2588 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
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